 2023年1/2月刊
編者寄語 Editor’s Notes
在不確定中迎接新的 發(fā)展契機(jī)
技術(shù)中心 Technologies Center
紅外超快激光脈沖串實現(xiàn)晶圓內(nèi)部3D加工
Ultrafast infrared laser bursts enable writing inside semiconductor chips
“半導(dǎo)體化”光子學(xué)時代來臨
Now is the time to ‘semiconductorize’ photonics
硅光芯片即將迎來應(yīng)用拐點？
Driving the era of silicon photonics with integrated lasers
快速了解基于CMOS相機(jī)的激光光束分析儀
Quick tutorial: laser beam profiling with camera-based systems
訪談 Interview
對光子學(xué)、創(chuàng)新、合作的熱情帶領(lǐng)公司大步向前
Passion for photonics, innovation and collaboration leads the company to stride forward
Interview with MKS Instruments CEO Dr. John T.C. Lee
市場觀察 Market Watch
盡管有逆風(fēng)，光子學(xué)市場依然呈現(xiàn)樂觀增長預(yù)期
Despite headwinds, the photonics industry still presents optimistic growth expectations
前沿簡訊 Leading Edge Snapshot
前沿簡訊
Leading Edge Snapshot
工業(yè)應(yīng)用專欄 Industrial Laser Column
激光加工結(jié)合仿生學(xué)實現(xiàn)自清潔光伏面板
Lasers, biomimetics enable self-cleaning photovoltaic panels
柔性激光表面預(yù)處理提升連接性能
Flexible laser surface pre-treatment for joining
使用兩種增材制造工藝打印混合材料制成的航 天部件
Laser metal deposition for additive manufacturing a hybrid propulsion component for space
激光加工技術(shù)在航空航天領(lǐng)域的應(yīng)用
A glimpse into laser applications in aerospace
納秒紅外光纖激光實現(xiàn)半導(dǎo)體材料的激光焊接
Laser welding for semiconductors
產(chǎn)品擷英 Products Highlight
產(chǎn)品擷英
Products Highlight
廣告索引 Ad Index
廣告索引
AD Index
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研究人員在半導(dǎo)體材料內(nèi)部寫入結(jié)構(gòu)，展示了3D激光寫入方法在推動半導(dǎo)體制造從2D向高密度3D集成器件發(fā)展方面的巨大潛力。